join us in upcoming EVEntS
Upcoming Workshops (Penang)
Workshops collaborate with Innocore-Solutions PLT
All above workshops are HRD corp funded
Glass Core Substrates for Advanced Packaging: Materials, Processes, and Integration (10-11 Dec 2026)
This workshop delivers a comprehensive introduction to System-in-Package (SiP) technology, beginning with the role of IC packaging in enabling compact, high-performance, and application-driven electronic systems and comparing SiP and SoC approaches across wireless, computing, power, and automotive markets. Participants gain a solid foundation in thermal and electrical management, covering heat transfer, thermal modeling, signal integrity, EMI, and noise mechanisms critical to reliable high-speed designs, followed by detailed coverage of interconnect technologies, board-level assembly, and soldering with emphasis on Pb-free materials and reliability.
The program concludes with an in-depth review of SiP assembly processes—from wafer thinning and die attach to encapsulation, plating, and trim-and-form—providing a holistic view of manufacturing flow and reliability considerations. This workshop is tailored to help engineers quickly get up to speed on the latest assembly technologies, materials, and industry best practices.
For workshop details, pls refer to the link
https://docs.google.com/document/d/180IytmwASc2vWzJ5FkR9VwtGAhTy-FvHI-caXkgmhns/edit?tab=t.0
For workshop details, pls refer to the link
https://docs.google.com/document/d/1dAJexRYM5yfX2bj6gqKL5zEu1-rMfDhXXlh9u_6qGe0/edit?tab=t.0
Advanced Packaging Interconnect Solutions: Flip Chip, Thermocompression, and Hybrid Bonding
(18-19 Jan 2027)
Advance your understanding of next-generation semiconductor packaging with this comprehensive workshop on interconnect technologies. Beginning with the fundamentals of packaging performance and reliability, the program explores mechanical, thermal, electrical, and chemical design factors, as well as heterogeneous integration architectures such as SoC, SiP, and chiplets.
Participants will gain in-depth knowledge of key bonding technologies—including Flip Chip (C4 and thermocompression), Thermocompression Bonding for fine-pitch applications, and Hybrid Bonding for sub-10 µm interconnects. Through detailed process insights, design considerations, and material innovations, this workshop equips engineers with the technical expertise to enhance performance, yield, and scalability in advanced packaging systems.
System-in-Package Assembly for High-Performance and Heterogeneous Integration (23-24 Nov 2026)
This workshop delivers a comprehensive introduction to System-in-Package (SiP) technology, beginning with the role of IC packaging in enabling compact, high-performance, and application-driven electronic systems and comparing SiP and SoC approaches across wireless, computing, power, and automotive markets. Participants gain a solid foundation in thermal and electrical management, covering heat transfer, thermal modeling, signal integrity, EMI, and noise mechanisms critical to reliable high-speed designs, followed by detailed coverage of interconnect technologies, board-level assembly, and soldering with emphasis on Pb-free materials and reliability.
The program concludes with an in-depth review of SiP assembly processes—from wafer thinning and die attach to encapsulation, plating, and trim-and-form—providing a holistic view of manufacturing flow and reliability considerations. This workshop is tailored to help engineers quickly get up to speed on the latest assembly technologies, materials, and industry best practices.
For workshop details, pls refer to the link
https://docs.google.com/document/d/1O981MXljhbfvBGQpUDfSwLdT0TMlLuA8OglR3bEUnTo/edit?tab=t.0
For more details of the workshops, pls sent email to sales@innocore-solutions.com
Venue: Amari SPICE Penang 2, Persiaran Mahsuri, Bayan Baru, 11900 Bayan Lepas, Pulau Pinang, Malaysia
Please request a quotation by emailing sales@innocore-solutions.com or proceed with registration and we will contact you.
