Masterclass Hub: Advanced Semiconductor Packaging Workshops

Bridge the Gap from Silicon Scaling to Next-Generation System Integration

As Moore’s Law slows, advanced packaging is the new frontier for semiconductor performance. Secure your team's competitive edge with our industry-vetted masterclass portfolio. We deliver practical, production-ready strategies covering everything from core material physics to hybrid bonding, glass substrates, and AI-driven manufacturing.

Track 2: Heterogeneous Integration & 3D Architectures

Deconstruct multi-die modular architectures, hybrid connections, and high-density stacking.

• Chiplet and Heterogeneous Integration for Semiconductor packaging

  • Core Focus: Design methodologies for heterogeneous integration and multi-die packaging. 

• Advanced Package Assembly Technologies and Performance Engineering in Heterogeneous Integration

  • Core Focus: Performance engineering tailored specifically for heterogeneous system integration.

• System-in-Package Assembly for High-Performance and Heterogeneous Integration

  • Core Focus: Assembly protocols for high-performance computing (HPC) nodes. 

• Interconnect Solutions for Chiplet and Heterogeneous Integration: Flip Chip, Thermocompression, and Hybrid Bonding

  • Core Focus: Comparative evaluation of Flip Chip, Thermocompression (TCB), and Hybrid Bonding.

• Next-Generation 3D Packaging: 3DIC integration and TSV Technology

  • Core Focus: Deep dive into 3DIC vertical integration and Through-Silicon Via (TSV) physics. 

• Co-Packaged Optics (CPO): From Heterogeneous Semiconductor Packaging to Next-Gen Optical I/O

  • Core Focus: Transitioning from traditional copper to next-generation optical I/O interfaces.

Flexible Corporate Training Delivery

On-Site Technical Labs: Hands-on training tailored directly to your team's current product tape-out.

Interactive Virtual Cohorts: Live, remote masterclasses designed for geographically distributed R&D teams.

Custom Modular Curriculums: Mix and match individual modules across tracks to build your perfect syllabus.

Track 1: Packaging Foundations & Executive Strategy

Align technical roadmaps with business objectives and structural engineering fundamentals.

• Semiconductor Packaging Assembly Excellence – Assembly, Material to Characterization

  • Core Focus: Master structural assembly, advanced material selection, and rigorous characterization.

• Design and Enhancement of Package Performance

  • Core Focus: Design and enhance package thermal, electrical, and mechanical capabilities.

• Semiconductor Packaging Substrate and Interposers: From Lead-frame, Ceramic, Organic, Silicon to Glass Substrates and Interposers

  • Core Focus: Comparative navigation of traditional and emerging substrate types.

• From PCB, Surface Mount Technology to joint reliability: PCB, SMT, soldering and its joint reliability

  • Core Focus: Managing board-level metallurgy and long-term solder joint integrity.

• Insight into Advanced Packaging and Trends for Business Executive

  • Core Focus: High-level strategic overviews of advanced packaging ecosystems and market trends.

Track 4: Substrate Fabrication, PCB & SMT Reliability

Prevent early board-level field failures through robust interfacial engineering and metallurgy.

• Data-Driven Manufacturing: Unlocking Productivity with TPM, OEE Analytics and Artificial Intelligence

  • Core Focus: Utilizing predictive maintenance, real-time Overall Equipment Effectiveness tracking, and machine learning models for defect classification.

• Insight to Industry 4.0 and AI for Manufacturing

  • Core Focus: Deploying smart sensor matrices, automated cyber-physical systems for deep-learning yield enhancement on the factory floor.

Track 3: Wafer, Panel & Precision Processing

Optimize high-density redistribution layers and microscopic die preparation techniques

• Breaking Down Fan-out Panel & Wafer-Level Packaging: Design, Assembly, and Competitive Technologies

  • Core Focus: Breaking down fan-out panel and wafer-level packaging mechanics.

• Wafer-Level Packaging and C4 Flip Chip Interconnects for Advanced Semiconductor Integration

  • Core Focus: Implementing robust wafer-level packaging and Controlled Collapse Chip Connections. 

• Backgrinding and Dicing in the Era of 3D IC and Advanced Packaging

  • Core Focus: Zero-defect wafer thinning and precision dicing for fragile 3D IC layouts.

Track 6: Smart Manufacturing, Industry 4.0 & AI for Manufacturing

Leverage Industry 4.0 data streams and artificial intelligence to optimize equipment availability, factory-wide OEE, and process yields

• The BT Substrate Journey in Semiconductor Packaging: Materials, Fabrication, Assembly to Reliability

  • Core Focus: Navigating Bismaleimide Triazine materials, fabrication, assembly, and reliability.

• Glass core substrate for advanced packaging: Material, Process and Integration

  • Core Focus: Practical look at glass materials, TGV processes, and system integration.

• Plating Technologies and Surface Treatments for High-Reliability Packaging

  • Core Focus: Advanced plating technologies and high-reliability surface finish metrics. 

• Insight to Surface Mount Technology: Material, Process, Equipment and Quality Control

  • Core Focus: Deep dive into surface mount technology materials, equipment, and line quality control.

• PCB Design & Electrical Performance: From Fabrication, Assembly to Embedded Passive Technologies

  • Core Focus: Managing electrical performance from raw fabrication to embedded passive technologies.

Track 5: Reliability Management & Failure Analysis

Diagnose, isolate, and mitigate yield-killing defects before they reach your customers.

• Package Reliability Management: Failure Mechanisms, Failure Analysis and Material Characterization Techniques

  • Core Focus: Systematic mapping of failure mechanisms using advanced material characterization.

• Corrosion & Delamination in Semiconductor Packaging: Mechanisms, Analysis, Package Enhancement

  • Core Focus: Root-cause analysis of package delamination and moisture-induced corrosion.

• Interfacial Adhesion and Surface Finishes in Microelectronics Packaging

  • Core Focus: Engineering surface finishes to eliminate microelectronics interface degradation.