Building Semiconductor Packaging Talents

Building block for semiconductor packaging innovations.

Semiconductor Packaging Core Modules

• Semiconductor Packaging Assembly Excellence – Assembly, Material to Characterization

• Design and Enhancement of Package Performance

• Material Characterization, Reliability Management, and Failure Analysis in Semiconductor Packaging

• Semiconductor Packaging Substrate and Interposers: From Leadframe, Flex, BT to Glass Substrates

• From PCB, Surface Mount Technology to joint reliability: PCB, SMT, soldering and its joint reliability

• Chiplet and Heterogeneous Integration for Semiconductor packaging

• Insight into Semiconductor Packaging Ecosystem and Trends: A Management Perspective

Specific Packaging Modules

• Breaking Down Fan-out Panel & Wafer-Level Packaging: Design, Assembly, and Competitive Technologies

• Wafer-Level Packaging and C4 Flip Chip Interconnects for Advanced Semiconductor Integration

• Backgrinding and Dicing in the Era of 3D IC and Advanced Packaging

• Interconnect Solutions for Chiplet and Heterogeneous Integration: Flip Chip, Thermocompression, and Hybrid Bonding

• Plating Technologies and Surface Treatments for High-Reliability Packaging

• Glass core substrate for advanced packaging: Material, Process and Integration

• The BT Substrate Journey in Semiconductor Packaging: Materials, Fabrication, Assembly to Reliability

• Insight to Surface Mount Technology: Material, Process, Equipment and Quality Control

• PCB Design & Electrical Performance: From Fabrication, Assembly to Embedded Passive Technologies

• Corrosion & Delamination in Semiconductor Packaging: Mechanisms, Analysis, Package Enhancement

• Interfacial Adhesion and Surface Finishes in Microelectronics Packaging

• Data-Driven Manufacturing: Unlocking Productivity with TPM, OEE Analytics and Artificial Intelligence

Customized Workshops is most welcome